Beyond Moore's Law.
The Photonic Future.
Energy Efficient. Compact. Scalable.
Next Gen Photonics for AI and High Performance Computing. Advanced research, engineering, and manufacturing.
The Physics of Efficiency: HIP-E Platform
The Challenge: End of Dennard Scaling, poor chip-to-chip bandwidth density, and high heat generation requiring massive cooling.
The Solution: Replacing copper traces with chip-scale optical networks utilizing our patented micro-disk modulator enabling multiplexing of wavelengths within a single waveguide.
20x more efficient than conventional circuits.
SWaP optimization.
High Bandwidth Density.
Using Wave Division Multiplexing (WDM).
Core Capabilities & Architectures
Patented Micro-disk Modulator in Photonic Integrated Circuits (PICs) enables sub 1 picojoule per bit photonic circuits.
HIP-E creates a cache-coherent Distributed Shared Memory (ccDSM), stitching together all memory into one coherent block via an all-to-all optical mesh.
Continuous Wave, Direct Modulated, and High Power photonics. CMOS, Compound Semiconductor, and Silicon-Photonic Chip-Scale Integration.
Bare die processor mated directly with HIP-E optical fabric. Hardware Cyber Defense providing physical layer protection against malware and data leakage.
Analog precision over fiber. Precision signal transmission that is lightweight, immune to EMI/EMP, and features ultra-low loss (0.4 dB/km).
Solutions for the Harsh Edge & Beyond
Space & Hypersonics
- Rad-Hard: Optical signals immune to cosmic radiation.
- Speed: 20x faster processing for real-time precision guidance at Mach speeds.
- Weight & Range: Eliminating copper shielding reduces launch mass, while a 20x energy reduction extends loitering endurance.
Data Centers
- Data Center Energy Crisis: Breaking the I/O bottleneck by forwarding clock signals with data allows for Zettascale computing without the thermal penalty, yielding an estimated 7,200 TWh in savings over 15 years.
- Bridging the Thermal Gap: Silicon photonics transfer data without transferring heat. Validated operation at 20 milli-Kelvin, allowing qubit generation at room temperature.
Development Roadmap & Vision
From component-level innovation to full system architecture.
Embedded Processors &
T-Core MCM
Multi-Chip Servers &
Scalable HPC Nodes
Full AI Systems
Exascale+ Supercomputer
(1000+ HPC Nodes)
Vertically Integrated Innovation
Status: Minority-owned small business. Validated by over $150M in investment.
Capability: Full domestic fabrication, packaging, and testing.
Who We Are
Advanced Photonic Integrated Circuits (APIC) Corporation is a pioneering photonics business founded in 1999 and headquartered in Culver City, CA (minutes from LAX). We have over 25 years of experience in developing advanced devices for the US military.
Our capabilities include photonic system design and integration, rapid photonic R&D and prototyping, and manufacturing of high performance electro-optic components.